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1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc817 ) 2. package resin : ul flammability grade (94v-0) features agency approvals/compliance 1. i/o isolation for mcus (micro controller units) 2. noise suppression in switching circuits 3. signal transmission between circuits of different po- tentials and impedances applications dip 16pin (4-channel) general purpose photocoupler 1. 16pin dip 4-channnel package 2. double transfer mold package (ldeal for flow solder- ing) 3. high collector-emitter voltage (v ceo : 80v) 4. current transfer ratio (ctr : min. 50% at i f =5ma, v ce =5v) 5. several ctr ranks available 6. high isolation voltage between input and output (v iso(rms) : 5.0kv) 7. lead-free and rohs directive compliant description PC847XJ0000F series contains an ired optically coupled to a phototransistor. it is packaged in a 4-channel package, available in smt gullwing lead-form option. input-output isolation voltage(rms) is 5.0kv. collector-emitter voltage is 80v and ctr is 50% to 600% at input current of 5ma. 1 sheet no.: d2-a03202en date jun. 30. 2005 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. PC847XJ0000F series ? 1-channel package type is also available. (model no. pc817xj0000f series ) PC847XJ0000F series
pc817 pc817 pc817 pc817 7.62 0.3 19.82 0.5 3.5 0.5 6.5 0.5 0.6 0.2 1.2 0.3 date code 2.54 0.25 0.26 0.1 epoxy resin 1.0 + 0.4 ? 0 1.0 + 0.4 ? 0 10.0 + 0 ? 0.5 0.35 0.25 1 2 3 4 5 6 7 8 11 10 13 14 15 16 12 9 factory identification mark anode mark internal connection diagram 2 sheet no.: d2-a03202en outline dimensions (unit : mm) pc817 pc817 pc817 pc817 7.62 0.3 : 0 to 13? 19.82 0.5 3.5 0.5 3.0 0.5 2.7 0.5 0.5 typ. 0.5 0.1 epoxy resin 6.5 0.5 0.6 0.2 1.2 0.3 anode mark factory identification mark date code 2.54 0.25 123 4 5 6 7 8 11 10 13 14 15 16 12 9 anode cathode emitter collector 16 15 14 13 12 11 10 9 1 3 5 7 2 4 6 8 9 11 13 15 10 12 14 16 1 2 3 4 5 6 7 8 1. through-hole [ex. PC847XJ0000F ] 2. smt gullwing lead-form [ex. pc847xij000f ] PC847XJ0000F series product mass : approx. 0.9g product mass : approx. 1.0g plating material : sncu (cu : typ. 2%)
date code (2 digit) a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production factory identification mark factory identification mark no mark country of origin japan indonesia china * this factory marking is for identification purpose only. please contact the local sharp sales representative to see the actual status of the production. 3 repeats in a 20 year cycle sheet no.: d2-a03202en PC847XJ0000F series rank mark there is no rank mark indicator.
sheet no.: d2-a03202en electro-optical characteristics parameter conditions forward voltage peak forward voltage terminal capacitance collector dark current collector-emitter breakdown voltage emitter-collector breakdown voltage transfer charac- teristics collector current collector-emitter saturation voltage isolation resistance min. ? ? ? ? 2.5 6 ? 5 10 10 ? ? typ. 1.2 ? 30 ? ? ? ? 0.1 1 10 11 4 3 max. 1.4 3.0 250 100 ? ? 30.0 0.2 ? 18 18 unit v v v v pf na ma v ? s s symbol v f v fm c t i ceo bv ceo bv eco i c v ce (sat) t r t f r iso response time rise time fall time input output i f = 20ma i fm = 0.5a v = 0, f = 1khz reverse current ?? 10 a i r v r = 4v v ce = 50v, i f = 0 i c = 0.1ma, i f = 0 i e = 10 a, i f = 0 80 i f = 5ma, v ce = 5v dc500v, 40 to 60%rh v ce = 2v, i c = 2ma, r l = 100 ? cutt-off frequency ? 80 ? khz f c v ce = 5v, i c = 2ma, r l = 100 ? , ? 3db floating capacitance ? 0.6 1.0 pf c f v = 0, f = 1mhz i f = 20ma, i c = 1ma (t a = 25?c) absolute maximum ratings (t a = 25?c) parameter symbol unit input forward current ma *1 peak forward current a power dissipation mw output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw total power dissipation mw *2 isolation voltage operating temperature ?c storage temperature ?c *3 soldering temperature i f i fm p v ceo v eco i c p c p tot v iso (rms) t opr t stg t sol ?c *1 pulse width 100 s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1 minute, f = 60hz *3 for 10s rating 50 1 70 reverse voltage v v r 6 80 6 50 150 200 ? 30 to + 100 ? 55 to + 125 260 5.0 kv 4 PC847XJ0000F series
sheet no.: d2-a03202en model line-up i c [ma] (i f = 5ma, v ce = 5v, t a = 25?c) 2.5 to 30.0 4.0 to 13.0 PC847XJ0000F pc847x5j000f through-hole 6.5 to 20.0 pc847x6j000f 10.0 to 30.0 pc847x7j000f 4.0 to 20.0 pc847x8j000f 6.0 to 30.0 pc847x9j000f 4.0 to 30.0 pc847x0j000f sleeve 25pcs/sleeve pc847xij000f pc847xi5j00f pc847xi6j00f pc847xi7j00f pc847xi8j00f pc847xi9j00f pc847xi0j00f smt gullwing model no. lead form package 5 please contact a local sharp sales representative to inquire about production status. PC847XJ0000F series
sheet no.: d2-a03202en fig.6 current transfer ratio vs. forward current duty ratio pulse width 100 s t a = 25?c 10 100 10 ? 3 10 ? 2 10 ? 1 peak forward current i fm (ma) 1 10 000 1 000 fig.5 peak forward current vs. duty ratio 6 PC847XJ0000F series forward current i f (ma) ambient temperature t a (?c) 0 50 40 30 20 10 ? 30 0 25 50 55 75 100 125 fig.1 forward current vs. ambient temperature diode power dissipation p (mw) ambient temperature t a (?c) 0 100 80 70 60 40 20 ? 30 0 25 50 55 75 100 125 fig.2 diode power dissipation vs. ambient temperature collector power dissipation p c (mw) ambient temperature t a (?c) 0 250 200 150 100 50 ? 30 0 25 50 75 100 125 fig.3 collector power dissipation vs. ambient temperature fig.4 total power dissipation vs. ambient temperature total power dissipation p tot (mw) ambient temperature t a (?c) 0 250 200 150 100 50 ? 30 0 25 50 75 100 125 current transfer ratio ctr (%) forward current i f (ma) 0.1 1 10 0 800 700 600 500 400 300 200 100 v ce = 5v t a = 25?c
sheet no.: d2-a03202en collector-emitter saturation voltage v ce (sat) (v) forward current i f (ma) 0 0 1 2 3 4 5 510 6 15 7ma 1ma 3ma 5ma i c = 0.5ma t a = 25?c fig.12 collector-emitter saturation voltage vs. forward current 80 60 40 20 0 ? 30 100 10 ? 5 10 ? 6 10 ? 7 10 ? 8 10 ? 9 10 ? 10 10 ? 11 collector dark current i ceo (a) ambient temperature t a (?c) v ce = 50v fig.11 collector dark current vs. ambient temperature relative current transfer ratio ( % ) 0 150 100 50 ? 40 0 ? 20 20 40 60 80 100 ambient temperature t a (?c) i f = 1ma, v ce = 5v i f = 5ma, v ce = 5v fig.9 relative current transfer ratio vs. ambient temperature 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 collector-emitter saturation voltage v ce (sat) (v) i f = 20ma i c = 1ma ambient temperature t a (?c) ? 40 0 ? 20 20 40 60 80 100 fig.10 collector - emitter saturation voltage vs. ambient temperature 7 PC847XJ0000F series 50?c 25?c 0?c 0 0.5 1 1.5 2 2.5 3 3.5 10 100 1 ? 25?c t a = 75?c forward current i f (ma) forward voltage v f (v) fig.7 forward current vs. forward voltage 0 0 5 1 10 15 20 25 30 23456789 20ma 10ma 5ma collector current i c (ma) collector-emitter voltage v ce (v) i f =30ma p c (max.) t a =25?c fig.8 collector current vs. collector-emitter voltage
sheet no.: d2-a03202en frequency f (khz) ? 20 0 1 ? 10 100 10 1k ? 100 ? voltage gain a v (db) r l = 10k ? v ce = 5v i c = 2ma t a = 25?c fig.15 frequency response v cc r l output please refer to the conditions in fig.15. r d fig.16 test circuit for frequency response remarks : please be aware that all data in the graph are just for reference and not for guarantee. 8 PC847XJ0000F series v cc t f t r t s 90% 10% t d output input r l input output r d please refer to the conditions in fig.13. v ce fig.14 test circuit for response time 0.01 0.1 1 10 10 0.1 1 100 response time ( s) v ce = 2v i c = 2ma t a = 25?c t s t d t f t r load resistance r l (k ? ) fig.13 response time vs. load resistance
sheet no.: d2-a03202en design considerations while operating at i f <1.0ma, ctr variation may increase. please make design considering this fact. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5 years) into the design consideration. ? for additional design assistance, please review our corresponding optoelectronic application notes. 9 design guide recommended foot print (reference) (unit : mm) PC847XJ0000F series 2.2 2.54 2.54 2.54 2.54 2.54 2.54 2.54 1.7 8.2
sheet no.: d2-a03202en manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 10 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) PC847XJ0000F series
sheet no.: d2-a03202en solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3 minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. cleaning instructions presence of odc 11 PC847XJ0000F series this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?ead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated di- phenyl ethers (pbde).
sheet no.: d2-a03202en sleeve package package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 25pcs of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions package specification 12 (unit : mm) 12.0 6.7 5.8 10.8 520 2 PC847XJ0000F series
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems rela- ted to any intellectual property right of a third party re- sulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the spec- ifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufac- turing locations are also subject to change without no- tice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: - -- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connec- tion with equipment that requires an extremely high lev- el of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment - -- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall with- in the scope of strategic products described in the for- eign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp de- vices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be repro- duced or transmitted in any form or by any means, elec- tronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this pub- lication. 13 sheet no.: d2-a03202en important notices PC847XJ0000F series [e189]

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